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A Full Spectrum of 3D Ferroelectric Memory Architectures Shaped by Polarization Sensing

Published: April 13, 2025 | arXiv ID: 2504.09713v1

By: Jiahui Duan , Asif Khan , Xiao Gong and more

Potential Business Impact:

Makes computer memory smaller, faster, and use less power.

Business Areas:
Semiconductor Hardware, Science and Engineering

Ferroelectric memories have attracted significant interest due to their non-volatile storage, energy efficiency, and fast operation, making them prime candidates for future memory technologies. As commercial Dynamic Random Access Memory (DRAM) and NAND flash memory are transiting or have moved toward three-dimensional (3D) integration, 3D ferroelectric memory architectures are also emerging, provided they can achieve a competitive position within the modern memory hierarchy. Given the excellent scalability of ferroelectric HfO2, various dense 3D integrated ferroelectric memory architectures are feasible, each offering unique strengths and facing distinct challenges. In this work, we present a comprehensive classification of 3D ferroelectric memory architectures based on polarization sensing methods, highlighting their critical role in shaping memory cell design and operational efficiency. Through a systematic evaluation of these architectures, we develop a unified framework to assess their advantages and trade-offs. This classification not only enhances the understanding of current 3D ferroelectric memory technologies but also lays the foundation for designing next-generation architectures optimized for advanced computing and high-performance applications.

Country of Origin
🇺🇸 United States

Page Count
65 pages

Category
Computer Science:
Emerging Technologies